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 Publisher's Letter
What a Year!

 Assembly Lines
Art for Art's Sake - Or What Is Intel's Dr. Noyce Doing on an AMD Sculpture?

 Standards
New Lead-Free Finishes Require Testing to Determine Best Reflow Temperatures

 Wafer-Level Watch
Wafer Level Establishes a Beachhead

 Harvey Miller's Notebook
Cost of Leadframe Packages Falling, Raising Cost of Entry for WLCSPs

 Industry News
Company News
People in the News
Packaging Foundries
Letters
Calendar of Events
Editorial Index

 Features
Cover Story: X-Ray Inspection - Increasingly Popular, Systems Offer a Non-Destructive View
Directory of X-Ray Inspection System Suppliers

Cover Story: How Ultrasound 'Sees' CSP Defects

Cover Story: Socket Makers Face New Demands for Tighter Pitches and More I/0s

Directory of Socket Vendors

A Critcal Review of the Top CSP Patents

Keep the Reliability, Dump the Lead: Japanese Companies Accelerate Lead-Free Packaging

 Technical Forum
Wire Bonding Optoelectronics Packages

 Tools & Technologies
Thermagon Claims 'Lowest' Impedance for Conductive Film and more...

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
November - December 2001
Socket Vendor Directory


Company Name
Address
Founded: Year Founded
Model
Introduced
I/O Range
Operating Temperature
(Degrees Celsius)
Contact Pitch (mm)
Technology
Inductance (nH)
Typical Insertions
Applications
Packages Accomodated
Handlers Accomodated
[website]
Contact e-mail
Phone: Phone Fax: Fax
Additional Offices
Note: Notes
E-Tec Interconnect Inc.
Industrial Zone C, CH-1072
Forel (Lavaux), Switzerland
Phone: +41.21.781.08.10
Fax: +41.21.781.08.11
Founded: 1992

BxW/LxW (screw lock)
BxK/LxK (knob lock)
BxP/LxP (solderless compression)
1995 (first 1.27 mm pitch models)
>2000
-55° to 130°
0.75, 0.80, 1, 1.27, 1.5
Spring contact
<5
1K
Pre-production and prototype
BGA, CSP, LGA
Not adapted to handlers
[e-tec.ch]
Chris Hafter info@e-tec.ch
USA: Bud Kundich
mailbox@kundich.com
Phone: 408.746.2800 Fax: 408.746.0969
Note: Patent-pending contact design
Everett Charles Technologies Semiconductor Test Group
4837 White Bear Pkwy.
St. Paul, MN 55110
Founded: 1963

Matrix Test Contactors
2001 No practical limit
-50° to 150°
0.5-1.27 incl. Kelvin
Bantam probe
0.8-1.3 1KK+
Strip test
BGA, CSP, LGA, QFN, QFP, etc.
Most major strip test handlers
[ectinfo.com]
Tony DeRosa,
Product Manager
derosat@ectinfo.com
Phone: 651.407.7777 Fax: 651.407.7290
Note: Matrix Test Contactors: High-registration accuracy architecture
Note: Universal Bantam-Pak: Package reconfigurable, short electrical path
Note: µHPC/DC: Ultra-high bandwidth
Note: µHPC/PL: Alignment to leadframe
Universal Bantam-Pak 2001 Up to 1156 universal, unlimited custom
-50° to 150°
0.5-1.27 incl. Kelvin
Bantam pin
0.8-1.3 1KK+
Test
BGA, CSP, LGA, QFN, etc.
Most handlers
µHPC/DC
2001 No practical limit
-55° to 155°
0.4-1.27
Elastomer
0.3 20K+
Characterization, test
BGA, CSP, QFN, etc.
Most handlers
µHPC/PL
1996 Up to 304
-55° to 155°
0.4-1.27
Micro-spring contact
1.0-2.2 400K+
Test LCC, SOJ, SSOP, QFP, PLCC, molded carrier ring, TAB, etc. Most handlers
Ever Technologies Pte. Ltd.
52 Seragoon North Ave. 4,
Singapore 555853
Founded: Not Supplied

Elite High Performance Test Socket
May 1999
Any I/O range
-40° to 150°
0.4-1.27
Double-ended
spring pins
0.8
>500K
Auto and hand test, prototype
All types
Customized to any handler
[aem-evertech.com]
S.M. Low, Regional Mgr., Sales & Mktg.
smlow@evertech.com.sg
Phone: +65.483.1321 Fax: +65.483.1811
Note: High-performance, reliable
Exatron Inc.
2842 Aiello Dr.
San Jose, CA 95111
Founded: Not Supplied

Exatron Top
Loader Socket
November 2000
-70° to 200°
As small as 0.4
Diamond interposer
Effectively zero
>100K (flex),
>1KK (rigid material)
Manual/automated handler applications
All standard packages,
including BGA and RF
Customized to most handlers
[exatron.com]
Robert Garcia
bgarcia@exatron.com
Phone: 408.629.7600 Fax: 408.629.2832
Note: Tested up to 18 GHz
Gryphics/Molex
3850 Annapolis Lane #140
Plymouth, MN 55447
Founded: 1997

QFN, JEDEC for MLP, MLF, LPCC, etc.
January 2001
4-72 (with multiple grounds)
-55° to 155°
0.5-0.8
Stamped and formed
0.74 (self), .082 (mutual)
50-100K
Burn-in, development,
prototype, test
QFN, BGA/CSP, LCC, SO
Adaptable to any handler
[gryphics.com]
Dennis L. Wagner,
Sales & Marketing Director
dwagner@gryphics.com
Phone: 763.509.0066 Fax: 763.509.0077
Note: GHz performance
High Performance Test Inc.
4408-B Enterprise Place
Fremont, CA 94538
Founded: 1996

Pogo Pin Test Socket
1996
No limit
Consult manufacturer
0.4-1.27
Spring probes
N/A
N/A
Auto and hand test, burn-in, prototype, failure analysis
All
All
[hptestusa.com]
Mark Malfatti,
Sales & Applications
mmalfatti@hptestusa.com
Phone: 510.445.1182 Fax: 510.445.1183
Note: Excellent compliance, ease of maintenance
Intercon Systems Inc.
2800 Commerce Dr.
Harrisburg, PA 17110
Founded: 1987

Land Grid Array Socket
Spring 2000
25-1657 positions
Tested through 85° per EIA specs
1 and 1.27*
Stamped contact springs
0.2 (mutual inductance)
5K (production sockets),
2K (test sockets)
Production and test
LGA
N/A
* Selective contact locations available w/ programmable assembly equipment
[interconsystems.com]
Colin Reynolds,
Customer Service Rep.
creynolds@interconsystems.com
Phone: 717.540.5660 Fax: 717.540.5839
Note: Solderless, low cost
Ironwood Electronics Inc.
990 Lone Oak Rd.
Eagan, MN 55121
Founded: Not Supplied

GHz BGA Direct Mount Socket
Spring 2001
N/A
0° to 85°
0.8-1.27
Elastomeric embedded wire contact
0.3
Up to 100K
Production and prototype test
All BGA package types. Some customization may be needed.
N/A
[ironwoodelectronics.com]
Mike Fedde
mikef@ironwoodelectronics.com
Phone: 800.404.0204 Fax: 651.452.8400
Note: Fast, dense, durable
Johnstech International
1210 New Brighton Blvd.
Minneapolis, MN 55413
Founded: 1991

Leaded Series 4 1991 Varies (package dependent)
-65° to 165°
0.5-1.27 (short rigid contact)
Elastomers
<1.1 (self), <0.22 (mutual) >100K, >500 (contacts), >1KK (housing)
Characterization and production test
QFP, SO, SOIC, SOJ
Gravity feed, pick-and-place
[johnstech.com]
Phil Musgrove,
Sales Director
info@johnstech.com
Phone: 612.378.2020 Fax: 612.378.2030
Johnstech International
2450 Scott Blvd.
Santa Clara, CA 95050
Johnstech Interconnect
1-2 Usk St., Newport, NP19 7BE
South Wales, United Kingdom
Note: Leaded Series 4: Long production life for low-voltage packages
Note: Leaded Series 2: For high-speed packages
Note: Ball Series: For high frequency packages
Note: Pad Series: Low electrical parasitics
Note: Edge Series: Long production life
Leaded Series 2 1994 Varies (package dependent)
-65° to 165°
0.5-1.27 (short rigid contact)
Elastomers
<0.9 (self), <0.2 (mutual) >100K, >500 (contacts), >1KK (housing)
Characterization and production test
QFP, SO, SOIC, SOJ
Gravity feed, pick-and-place
Ball Series 1996
Varies (package dependent)
-65° to 165°
0.5-1.27 (short rigid contact)
Elastomers
<1.0 (self), <0.2 (mutual) >100K, >500 (contacts), >1KK (housing)
Characterization and production test
BGA, CSP
Pick-and-place
Pad Series 2000
Varies (package dependent)
-65° to 165°
0.5-1.27 (short rigid contact)
Elastomers
<1.0 (self), <0.2 (mutual) >100K, >500 (contacts), >1KK (housing)
Characterization and production test
BCC, MLF, MLP, QFN
Gravity feed, pick-and-place
Edge Series 1998
Varies (package dependent)
-10° to 120°
0.5-1.27 (short rigid contact)
Elastomers
<1.7 (self), <0.5 (mutual) >100K, >500 (contacts), >1KK (housing)
Characterization and production test
DIMM, ISA, PCI, RIMM
Pick-and-place
Kulicke & Soffa Industries Test Division
1150 North Fiesta Blvd.
Gilbert, AZ 85233
Founded: 1951

Strip Test Contactor
July 2001
Up to 32 ICs (with 784 I/O)
-45° to 150°
0.4
Spring-loaded probes
0.4
>100K
Multi-package test
BGA/CSP
All strip test handlers
Note: Parallel testing of multiple devices
[kns.com]
Vince Gonzales vgonzales@kns.com
Phone: 480.333.1500 Fax: 480.333.1671
Note: Acquisition of CERPROBE and OzTek
Loranger International Corp.
817 Fourth Ave.
Warren, PA 16365
Founded: 1968

037/038 Series
November 1998 5-65+
to 210°
0.5 to 1.27
Through-hole stamped microspring
4-5 50K
Burn-in, prototype, test
QFN
Customized to most handlers
[loranger.com]
Dan Zingone
danz@loranger.com
Phone: 814.723.2250
Note: HPS = High-performance/speed for customer-specific applications
Note: Sockets available with heatsink compliant cover
160SQ 288T Series
December 1998
8-576
to 140°
0.5 to 1.27
Surface mount compression
8.3 (to 1.05 w/HPS) 50K
Burn-in, prototype, test
BGA
Customized to most handlers
300140072B/L Series
July 2001
58-143
to 140°
0.5 to 1.27
Surface mount compression
8.3 (to 1.05 w/HPS) 50K
Burn-in, test
BGA/LGA Fiber Optic
Customized to most handlers

 
Copyright © 2001