Atlantic Technology, UK and Siroyan Ink Manufacturing Pact Crumlin, U.K.-Under a recently signed agreement, Atlantic Technology will assemble and package Siroyan's test chip, code-named Spey, into a 300-LBGA 19x19 package at its South Wales facility. The test chip will be a version of Siroyan's first synthesizable core, codenamed Rubicon. Silicon for the Spey chip will be fabricated by UMC, Taiwan, through its Silicon Shuttle program. Siroyan is headquartered in Reading, U.K. [atlantic-us.com]
Chandler, Ariz.-Amkor Technolo-gy Inc. has signed a strategic agreement with King Yuan Elec-tronics, a test house based in Taiwan's Hsin Chu region. The agreement includes, but is not limited to, sharing technology and business resources. The Taiwanese firm offers a full range of test services, according to Amkor, from test development to tape and reel packaging. Amkor will also provide assembly services to King Yuan, enabling the Taiwanese company to expand its own business in Taiwan. [amkor.com] Kyocera Flip-Chip Package Substrates Withstand 260°C San Diego, Calif.-Kyocera has introduced what it claims is the industry's first flip-chip build-up substrate capable of withstanding 260°C solder reflow, needed for lead-free processing. The substrates are made at Kyocera's SEndai and Kokubu factories in Kagoshima, Japan. To verify that Kyocera's HDBUO substrates are compatible with lead-free processing, which often requires higher reflow temperatures, the packages were preconditioned at JEDEC Level 3 (30°C/60%RH for 192 hours), then passed through a 260°C reflow profile 3X. [kyocera.com]
Singapore-ST Assembly Test Services Ltd. (STATS) is implementing a comprehensive IT architecture that will be linked seamlessly to customers' manufacturing operations. The system is scheduled to be fully operational by Q2 '02. The architecture comprises two key components: MySTATS and e-TAS. The former is an external, self-service portal that will link with customers' networks, offering online access to real-time and reliable WIP reports. e-Tas will enable customers to retrieve real-time information and reports from the shop floor. [stts.com] Shellcase Will Invest $8M for Facilities Expansion Jerusalem-Shellcase is expanding its production facility at a cost of $8 million, which will triple production floor area. The enlarged plant is due for completion this month. The expansion will add 1,500 square meters of cleanroom production floor space, which will be used to process silicon wafers and package them in the company's miniaturized packaging. The company says it has begun a major recruiting drive to add to its existing 150 employees. [shellcase.com] LSI Logic Enters Licensing Agreement with SPIL Milpitas, Calif.-LSI Logic Corp. has licensed Siliconware Precision Industries Ltd., Taiwan, to employ the former's organic laminate flip-chip BGA technology. The pact provides SPIL with access to several of LSI Logic's proprietary technologies, including the four-layer FPBGA, the high-performance FPBGA-HP and the flxI/O flip chip, LSI's newest packaging family. [spilca.com] |
Amkor Signs Strategic Agreement with King Yuan
STATS Adds IT Software to Link with Customers' NetworksCopyright © 2001