Media Kit
For advertisements and demographics
click here
On Line Reader Service
 Publisher's Letter
What a Year!

 Assembly Lines
Art for Art's Sake - Or What Is Intel's Dr. Noyce Doing on an AMD Sculpture?

 Standards
New Lead-Free Finishes Require Testing to Determine Best Reflow Temperatures

 Wafer-Level Watch
Wafer Level Establishes a Beachhead

 Harvey Miller's Notebook
Cost of Leadframe Packages Falling, Raising Cost of Entry for WLCSPs

 Industry News
Company News
People in the News
Packaging Foundries
Letters
Calendar of Events
Editorial Index

 Features
Cover Story: X-Ray Inspection - Increasingly Popular, Systems Offer a Non-Destructive View
Directory of X-Ray Inspection System Suppliers

Cover Story: How Ultrasound 'Sees' CSP Defects

Cover Story: Socket Makers Face New Demands for Tighter Pitches and More I/0s

Directory of Socket Vendors

A Critcal Review of the Top CSP Patents

Keep the Reliability, Dump the Lead: Japanese Companies Accelerate Lead-Free Packaging

 Technical Forum
Wire Bonding Optoelectronics Packages

 Tools & Technologies
Thermagon Claims 'Lowest' Impedance for Conductive Film and more...

 Archives
2001
Jan-Feb March April
May-June July Aug-Sep
October Nov-Dec  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription

 
Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
November - December 2001
People In The News
Christine King

AMI Semiconductor Appoints Christine King President/CEO

Pocatello, Idaho-AMI Semiconductor has appointed Christine King president and CEO. She joined AMIS from IBM Microelec-tronics' Semiconduc-tor Products.

While at IBM, King also launched IBM's networking technology semiconductor business and earlier served as director of IBM's field engineering programs and global marketing. [amis.com]

APEX Plans New Courses

APEX has scheduled 64 professional development courses for APEX 2002, from January 19-24, in San Diego. [apex2002.org]

Karl Suss Expands Asian Presence with Taiwan Center

Munich, Germany-Sus MicroTec AG, the holding company for Karl Suss, has opened a sales and service support center in Hsinchu, Taiwan. The Taiwan expansion follows the company's April expansion into Shanghai, China. [suss.com]

'Survey' Winners Get Book

Three participants in Chip Scale Review's recent salary survey were randomly selected to receive autographed copies of Charles A. Harper's recent McGraw-Hill publication, Electronic Packaging and Inter-connection Handbook.

David Chapman of Circuit Service Inc., Wheeling, Ill.; Fernando Chen of Legerity Inc., Austin, Texas; and Dr. Nancy Dean of Honeywell Electronic Materials, Spokane, Wash., won copies of this authoritative work, courtesy of McGraw-Hill. [mcgrawhill.com]

Dr. Claudio Truzzi

Dr. Truzzi Leaves CS2; Forms Packaging Consulting Firm

Maastricht, Netherlands-Dr. Claudio Truzzi, most recently director of engineering and technology at packaging foundry CS2, Belgium, has left to form his own consulting business.

Known as Convergix (from Convergent Electronics), Dr. Truzzi will specialize in advanced packaging technologies. [claudio.truzzi@convergix.nl]

FSA Releases Wafer Survey

San Jose-The Fabless Semiconductor Association (FSA) has released its second- quarter wafer-pricing survey. The survey gauges the average price paid per wafer by fabless companies. [fsa.org]

Paul Lin

PBGA Co-Inventor Paul Lin Joins Kulicke & Soffa Industries

Willow Grove, Pa.-Paul Lin, co-inventor of the Plastic Ball Grid Array, has joined Kulicke & Soffa Industries as director of process integration, based in Milpitas, Calif. He will report to Jack Belani, president of the company's Wire Bonding Division.

Lin will focus on integrating K&S substrates with probe, assembly and test processes used in the development of advanced IC packages.

The holder of more than 50 patents, Lin was most recently founder and president of Array Packaging Technology Inc., Fremont, Calif. Earlier, he was vice president of product management for the Alphatec Group, Santa Clara, Calif.

While at Motorola, where his posts included director of packaging development, he co-invented the PBGA, fine pitch quad flat pack with molded carrier ring and several other industry-standard packages. Lin earned a master's degree in physical metallurgy from the University of Minnesota and a bachelor's degree in mining/metallurgical engineering from Chung Kung University in Taiwan. [kns.com]

FeinFocus USA Hires Dupree as Regional Sales Manager

Stamford, Conn.-FeinFocus USA, a supplier of x-ray inspection systems, has named Jon Dupree regional sales manager for the company's northern territory.

Based in Nashua, N.H., Dupree will manage an area which includes the northern Midwest, eastern Canada and New England. Prior to joining FeinFocus, he was an independent manufacturers' representative for assembly products. [feinfocus.de]

Wayne Moore

AIT Adds Veterans Moore, Shaw as Vice Presidents

Pleasanton, Calif.-Wayne F. Moore and George A. Shaw Jr., have joined Advanced Inter-connect Technologies Inc. as vice presidents.

Ron Cates

Moore, who was most recently president of Signetics High Tech-nology Inc., San Jose, was appointed AIT's vice president of sales and special accounts. Shaw, who will be based in Hong Kong, joined AIT as senior vice president of operations from Amkor Technology Inc., where he held a similar post in Asia. Earlier, he was president of Alphatec U.S.A. [aitsales.com]

Peregrine Semiconductor Names Cates Photonics VP, GM

San Diego-Peregrine Semiconductor, a supplier of ICs for optical networking and wireless communications, has named Ron Cates vice president and general manager of its photonics division.

Cates most recently served as vice president of the Broadband Access Business Unit at Conexant Systems, where he spent eight years in the development and marketing of DSL ICs and subsystems. [peregrine-semi.com]

 
Copyright © 2001