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On Line Reader Service
 Publisher's Letter
What a Year!

 Assembly Lines
Art for Art's Sake - Or What Is Intel's Dr. Noyce Doing on an AMD Sculpture?

 Standards
New Lead-Free Finishes Require Testing to Determine Best Reflow Temperatures

 Wafer-Level Watch
Wafer Level Establishes a Beachhead

 Harvey Miller's Notebook
Cost of Leadframe Packages Falling, Raising Cost of Entry for WLCSPs

 Industry News
Company News
People in the News
Packaging Foundries
Letters
Calendar of Events
Editorial Index

 Features
Cover Story: X-Ray Inspection - Increasingly Popular, Systems Offer a Non-Destructive View
Directory of X-Ray Inspection System Suppliers

Cover Story: How Ultrasound 'Sees' CSP Defects

Cover Story: Socket Makers Face New Demands for Tighter Pitches and More I/0s

Directory of Socket Vendors

A Critcal Review of the Top CSP Patents

Keep the Reliability, Dump the Lead: Japanese Companies Accelerate Lead-Free Packaging

 Technical Forum
Wire Bonding Optoelectronics Packages

 Tools & Technologies
Thermagon Claims 'Lowest' Impedance for Conductive Film and more...

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Current Issue
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
November - December 2001

What a Year!
Gene Selven
Publisher

It's been quite a year!

It was certainly a year of accomplishment for Chip Scale Review, despite a sagging economy that was sucker-punched by the September 11 terrorist attacks that claimed so many innocent lives.

Last year, Chip Scale Review climbed many hurdles. We grew 16 percent in number of ad pages and 19 percent in revenue over the previous year. We also expanded our value-added services for advertisers and readers by adding online reader service at our website, ChipScaleReview.com. Additionally, we qualified for a second class mailing permit, which will result in faster delivery to our U.S. subscribers.

We are scheduled to complete our BPA International audit before the year is over. BPA International is a not-for-profit organization that audits media, worldwide, on a regular basis.

The BPA certification assures advertisers that only readers who are interested in their products and services receive the magazine.

In 2002, we plan to add a ninth issue, a comprehensive resource directory, and expand our editorial coverage both domestically and internationally. We'll add substantive editorial about optical packaging and other important technologies.

We have no plans for a general magazine redesign. The old cliché, "If it ain't broke don't fix it" seems to apply here. Our readers have told us they like Chip Scale Review pretty much the way it is.

We will, however, continue to make minor changes in every issue, striving to improve content, layout and reader friendliness.

Just as we readied this issue for press in late September, we learned that HDI magazine, one of our competitors, closed its doors. Let me assure you that Chip Scale Review is strong, dedicated and will continue to grow and thrive in the market it serves.

Unlike HDI and our two remaining competitors, both of which are part of multibillion dollar media giants, Chip Scale Review is an independent journal, and our only publication. As such, we will continue to give it our total economic and emotional resources.

As we close 2001, we thank you, our readers. We also thank the nearly 100 advertisers who supported us through this year's difficult times. I look forward to thanking each advertiser personally, and I pledge to redouble our efforts on their behalf in 2002.

Next year at this time, I hope we can look back at 2002 and say, "What a great recovery year this has been!"

[gselven@ChipScaleReview.com]

 
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