Thermagon Claims 'Lowest' Impedance for Conductive Film Thermagon Inc., Cleveland, Ohio, has introduced T-PCM HP 105, a phase-change type of conductive film that is naturally tacky at room temperature. The film is 0.005 in. thick and non-electrically conductive. It begins to soften and flow at 50°C, filling microscopic irregularities. The company claims T-pcm HP 105 offers a 50% improvement in thermal impedance over other phase-change materials. T-pcm is supplied in rolls with a red top tabbed liner for easy application. Individually die-cut shapes are also available. [thermagon.com] GDSI Expands, Adds Automatic Flipped Die Tape & Reel Service Grinding & Dicing Services Inc., Sunnyvale, Calif., has expanded and added automatic flipped die tape and reel service to its existing vertically integrated line of high-volume wafer grinding and backside polishing services. GDSI can grind customer wafers with 10.0 mil high bumps, saw the wafers, provide 100% inspection and then transfer KGD to tape and reel. [wafergrind.com]
'Bandit-II MV' Frame Grabber Aimed at Industrial Vision Needs Coreco Imaging, St. Laurent, Quebec, Canada, has introduced the Bandit-II MV monochrome frame grabber with integrated VGA display. The unit is designed to meet the unique needs of industrial vision automation. [imaging.com] Phoenix X-Ray Systems Begins Contract Inspection Phoenix X-Ray Systems & Services, Camarillo, Calif., has introduced a contract inspection service using the company's x-ray inspection equipment. Offered at the company's Camarillo facility, the service is targeted at makers of ICs and PC boards. The customer may use the facility and equipment or can ship products to Phoenix for inspection. [phoenix-xray.com] APS Develops Two-Component Pouches for Aerospace Coatings Advanced Packaging Specialties, Peabody, Mass, has developed a two-component flexible pouch designed for aerospace coatings. The design of the pouches separates parts a and b components until mixing. A burst seal design introduces the two parts when pressure is applied to one side. The A-PAK is available in custom sizes and provides a safe, pre-ratioed, clear mixing view of the material. [adhesivepackaging.com]
Yamaichi Electronics Intros Fine-Pitch BGA/LGA Socket Yamaichi Electronics USA, San Jose, has introduced the IC398 series of fine-pitch BGA/LGA test and burn-in sockets. These open-top 0.5 mm pitch sockets feature a smooth, rounded-cup contact tip to minimize ball damage and provide good contact force. The open-top design facilitates automatic load/unload with easy actuation. [yeu.com] Unitek Miyachi Announces New Nd:YAG Laser Series for Welding Unitek Miyachi, Monrovia, Calif., has announced the A-Series of its Nd:YAG lasers, designed specifically for precision welding applications in photonics, precision medical devices and disk drive components. Lasers in the series feature an average output power ranging from 5-70W. The company says its real-time power feedback features ensures great pulse-to-pulse energy stability. [unitekmiyachi.com]
Valtronic Offers Patented Gold-on-Gold Flip-Chip Process Valtronic, Cleveland, Ohio, is offering its gold-on-gold flip-chip process for producing ultra-miniature electronic assemblies. The Valtronic process relies on a low-impedance, direct meal-to-metal contact between die and PC board pads. Lead length is virtually zero, which reduces the capacitive, inductive and resistive effects common to traditional wire lead systems. [valtronic.com] Dexter's Hysol GR9800 Debuts Dexter Electronic Materials, Olean, N.Y., a division of Loctite Corp., is now offering Hysol GR9800, a high-productivity molded underfill formulated for flip-chip array packages. The product meets JEDEC Level 3 at 260°C requirements. Since it allows for the package matrix to be underfilled as a unit, rather than individually, before dicing, the need for a liquid underfill step is eliminated. [dexelec.com] |
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