Media Kit
For advertisements and demographics
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On Line Reader Service
List of the sponsors with ChipLinks

 Publisher's Letter
Farewell to 2002

 Assembly Lines
Doing Business in Japan? San Jose's Tessera Looks to Licensees, Partners

 Opto-Electronically Speaking 
When the Economy Rebounds, So Will Opto, MEMS and Nanotech Excitement

 Standards
Testing Packages with Lead-Free Finishes? MRT Reflow Standard Is Finally Revealed

 On Test
Parts, Pins, Parallelism, BIST and DFT - Pieces of the Final Test Conundrum

 Industry News
Company News
FSA Suppliers Expo Album
People in the News
Opto/Nanotechnology
Packaging Foundries
Calendar of Events
Editorial Index

 Features
Solder Ball Placement: Machine Makers and Users Are Preparing for Smaller Ball Diameters
Solder Ball Placement Equipment Directory

Defect Inspection: Core Technology Choices Range from AOI to Lasers to Moiré Interferometry to Scanners

Automated Defect Inspection Systems Directory

Assembling Chip-Scale Packages with High Yields Requires Care with Printing and Reflow Processes

Editorial Index for 2002

Test-on-Strip: What It Takes, What It Offers Users

Wire Bonding: the Preferred Interconnect Method

 Tools & Technologies
Solderless Sockets for Evaluation Test and more...

 Patents
Invention Describes How to Form Wafer-Level Hermetic Packages

 Archives
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November - December 2002
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging

Calendar of Events

Please submit calendar listings to the editor at least two months prior to cover date. Due to limited space, listings are restricted to non-commercial, non-profit organizations.

April

16-18

International Conference on Electronics Packaging (ICEP)
Tokyo, Japan
IMAPS [imaps-j@jiep.or.jp]
May

6-8

SEMICON Singapore 2003
Suntec Singapore Int'l Convention and Exhibition Centre
SEMI [semi.org]

15

Chip Scale Review and MEPTEC Present
MEMS and Advanced Packaging Technologies
Four Points Sheraton, Sunnyvale, Calif.
Chip Scale Review [ChipScaleReview.com] and MEPTEC [mepteconline.com]

19-21

ASME 3rd Annual MEMS Technology Seminar
Los Angeles, California
[asme.org]
June

14-18

14-16 (Exhibits)
14-18 (Conference)
SEMICON West (Wafer Processing)
Moscone Center, San Francisco
SEMI [semi.org]

14-18

16-18 (Exhibits)
14-18 (Conference)
SEMICON West (Final Manufacturing)
San Jose Convention Center
SEMI [semi.org]

 
Copyright © 2002