Media Kit
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On Line Reader Service
List of the sponsors with ChipLinks

 Publisher's Letter
Farewell to 2002

 Assembly Lines
Doing Business in Japan? San Jose's Tessera Looks to Licensees, Partners

 Opto-Electronically Speaking 
When the Economy Rebounds, So Will Opto, MEMS and Nanotech Excitement

 Standards
Testing Packages with Lead-Free Finishes? MRT Reflow Standard Is Finally Revealed

 On Test
Parts, Pins, Parallelism, BIST and DFT - Pieces of the Final Test Conundrum

 Industry News
Company News
FSA Suppliers Expo Album
People in the News
Opto/Nanotechnology
Packaging Foundries
Calendar of Events
Editorial Index

 Features
Solder Ball Placement: Machine Makers and Users Are Preparing for Smaller Ball Diameters
Solder Ball Placement Equipment Directory

Defect Inspection: Core Technology Choices Range from AOI to Lasers to Moiré Interferometry to Scanners

Automated Defect Inspection Systems Directory

Assembling Chip-Scale Packages with High Yields Requires Care with Printing and Reflow Processes

Editorial Index for 2002

Test-on-Strip: What It Takes, What It Offers Users

Wire Bonding: the Preferred Interconnect Method

 Tools & Technologies
Solderless Sockets for Evaluation Test and more...

 Patents
Invention Describes How to Form Wafer-Level Hermetic Packages

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November - December 2002
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
FSA Suppliers Expo Album

Santa Clara, Calif.-Despite the lingering industry recession, interest was keen and visitors were abundant at the Fabless Semiconductor Association's October Suppliers Expo at the Convention Center. [fsa.org]

Lisa Lavin, STATS, made the trip to California from her home in Idaho for the one-day event.
Glenn Koscal, Carsem (left) discusses old times with Satya Chillara, WR Hambrech (formerly with competitor ChipPAC). Paul Smith, Carsem, is in the background.
Bob Ingols, IROC (left), explains the company's intellectual property business to Roberto Rivera of Sony Electronics Inc.
Don Green of Davidow Ventures (left) visits the Teradyne booth, staffed by Joe Rohlfes.
 
Copyright © 2002