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On Line Reader Service
List of the sponsors with ChipLinks

 Publisher's Letter
Farewell to 2002

 Assembly Lines
Doing Business in Japan? San Jose's Tessera Looks to Licensees, Partners

 Opto-Electronically Speaking 
When the Economy Rebounds, So Will Opto, MEMS and Nanotech Excitement

 Standards
Testing Packages with Lead-Free Finishes? MRT Reflow Standard Is Finally Revealed

 On Test
Parts, Pins, Parallelism, BIST and DFT - Pieces of the Final Test Conundrum

 Industry News
Company News
FSA Suppliers Expo Album
People in the News
Opto/Nanotechnology
Packaging Foundries
Calendar of Events
Editorial Index

 Features
Solder Ball Placement: Machine Makers and Users Are Preparing for Smaller Ball Diameters
Solder Ball Placement Equipment Directory

Defect Inspection: Core Technology Choices Range from AOI to Lasers to Moiré Interferometry to Scanners

Automated Defect Inspection Systems Directory

Assembling Chip-Scale Packages with High Yields Requires Care with Printing and Reflow Processes

Editorial Index for 2002

Test-on-Strip: What It Takes, What It Offers Users

Wire Bonding: the Preferred Interconnect Method

 Tools & Technologies
Solderless Sockets for Evaluation Test and more...

 Patents
Invention Describes How to Form Wafer-Level Hermetic Packages

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November - December 2002
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
Opto/Nanotechnology
Micrograph of single wall carbon nanotube

BuckyPearl Carbon Nanotubes Targeted for Polymer Processing

Houston, Texas-Carbon Nanotechnologies Inc. has developed BuckyPearl nanotubes. The company says these are an improvement over other single-wall carbon nanotubes and can be handled more easily in extruders and other polymer-processing equipment.

Nanotubes are perfect molecular structures at the atomic level that conduct electricity better than copper, conduct heat better than diamonds and display a tensile strength 100x that of steel. [carbonnanotubes.com]

OpNext Completes Acquisition of Hitachi's Opto-Device Div.

Eatontown, N.J.-OpNext, Inc., formed from Hitachi's fiber-optic components business last year, has completed the acquisition of Hitachi's Semiconductor and Integrated Circuits Opto-Device Division. [opnext.com]

Sarnoff Labs Wins Sensor Contract

Knoxville, Tenn.-Sarcon Microsystems has awarded a production contract for a 320 x 240 MEMS IR sensor array to Sarnoff Corp., Princeton, N.J. (formerly RCA Laboratories). [sarcon.com]

Newport and EM4 Will Jointly Develop Fiber-Optic Equipment

Irvine, Calif.-Newport Corporation and EM4 Photonics, Burlington, Mass., have signed a letter of intent whereby they will jointly develop and refine photonics device manufacturing equipment and processes. The agreement also calls for Newport to become a preferred equipment supplier to EM4.

As part of the agreement, EM4 will provide Newport with an exclusive license to employ some of EM4's optoelectronic packaging technology in Newport's automated manufacturing equipment. Newport will also become a preferred supplier to EM4 for all test and assembly equipment to support the latter's optical manufacturing services business. [newport.com]

 
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