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 Publisher's Letter
Farewell to 2002

 Assembly Lines
Doing Business in Japan? San Jose's Tessera Looks to Licensees, Partners

 Opto-Electronically Speaking 
When the Economy Rebounds, So Will Opto, MEMS and Nanotech Excitement

 Standards
Testing Packages with Lead-Free Finishes? MRT Reflow Standard Is Finally Revealed

 On Test
Parts, Pins, Parallelism, BIST and DFT - Pieces of the Final Test Conundrum

 Industry News
Company News
FSA Suppliers Expo Album
People in the News
Opto/Nanotechnology
Packaging Foundries
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Editorial Index

 Features
Solder Ball Placement: Machine Makers and Users Are Preparing for Smaller Ball Diameters
Solder Ball Placement Equipment Directory

Defect Inspection: Core Technology Choices Range from AOI to Lasers to Moiré Interferometry to Scanners

Automated Defect Inspection Systems Directory

Assembling Chip-Scale Packages with High Yields Requires Care with Printing and Reflow Processes

Editorial Index for 2002

Test-on-Strip: What It Takes, What It Offers Users

Wire Bonding: the Preferred Interconnect Method

 Tools & Technologies
Solderless Sockets for Evaluation Test and more...

 Patents
Invention Describes How to Form Wafer-Level Hermetic Packages

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November - December 2002
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
People in the News
Megan Wendling

Chip Scale Review Appoints Megan Wendling to Sales Post

San Jose-Megan Wendling has joined Chip Scale Review as sales manager for Southern California and Florida. In addition, she will cover selected accounts in the East. Wendling has represented leading magazines in the electronics and semiconductor packaging fields for nearly two decades. "We are fortunate to have someone with Megan's credentials join us," said Gene Selven, Chip Scale Review publisher.

"Megan is widely known and respected throughout the industry, and has made many friends over the years," Selven added.

She can be reached at megwend@aol.com or by phone at 239.403.0259.

Dr. Ning-Cheng Lee

SMTA Honors Indium's Lee, IBM's Cole at Annual Meeting

Chicago-The Minneapolis-based SMTA recently honored Indium Corp. of America's Dr. Ning-Cheng Lee and Marie Cole of IBM Micro-electronics with its "Member of Dis-tinction" award.

The awards were presented at SMTA's annual meeting.

Since joining the SMTA in 1994, Dr. Lee has continuously served as presenter, session chair and tutorial instructor. He is also helping the society expand internationally.

Cole, who also joined in 1994, has helped the SMTA stay at the "leading edge of today's BGA packaging technology." She has also taught more than a dozen courses at the SMTA Academy's program. [smta.org]

Krawiec Joins StratEdge as Senior Account Manager

San Diego-Casey Krawiec has joined StratEdge, designer and assembler of IC packages, as senior account manager.

Krawiec spent the past seven years at Kyocera America, also in San Diego, where he was offshore sales manager and sales engineer. [stratedge.com]

Gudat Named New Sales Manager for Dage in Europe

Aylesbury, England-Dage Semiconductor GmbH, Germany, has appointed Joachim Gudat sales manager for Europe, based in the U.K., for its X-Ray products unit.

An electronics engineer, Gudat has held various engineering, sales and management posts with Fairchild, FeinFocus and GenRad. [dage.com]

Palomar Names Wai Chew Director of Its Asian Office

Vista, Calif.-Palomar Technologies has appointed Wai Seng Chew director of its Asian office in Singapore, where he will be in charge of business in most of southeast Asia.

Chew joined the company from Vison Inspection Technology, where he was general manager. Palomar's Singapore facility includes demo machines, training and application support. [bonders.com]

 
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