November - December 2002 The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging Email the editor

Gene Selven Publisher

What can one say about 2002 other than we're glad its over? Now, let's move on to better days and a new beginning in our lives and in our businesses in 2003.

I want to thank our advertisers in 2002, without whom there wouldn't be a Chip Scale Review. I would also like to thank our readers around the world for their positive comments about our magazine's focus in the chip-scale, flip-chip and wafer-level packaging technologies.

To paraphrase the many comments from our readers, "Chip Scale Review is our reference source and its original editorial content identifies the trends in this burgeoning marketplace".

Once called a niche publication, Chip Scale Review has become the leading magazine in the IC packaging world; at the same time, the niche has been lengthened and broadened. Traditional SMT assembly technologies are shifting to high gear into chip-scale electronics. This next generation of chip packaging employing bump technology is the catalyst that is providing the convergence between the front and backend. At long last, perhaps, these disparate parts will start working together.

What Makes Us Unique

I'd like to take a minute and describe to you, the advertiser and reader, what makes Chip Scale Review unique and why we are so proud of our magazine:

• Our news selection is audience specific. Our 26,000 circulation is selected and BPA-audited to ensure that advertiser messages reach the right people.

• We have more staff-written original articles (and staff) focusing on the technology trends than any other magazine in our field! Take a look at the other publications' size and content, and you'll see what I mean.

• Chip Scale Review doesn't resort to publishing old news or contributed articles that have appeared in other publications. Our staff -written and contributed articles are original, unique and cutting edge in content.

• The layout of staff-written articles includes extensive vendor lists, with detailed specs, to compliment major articles-another unique feature of CSR and one that produces many leads for companies listed in the tables.

• Ads are always placed opposite (or adjacent to) editorial. This is another unique feature of CSR and one that encourages the reader to review CSR cover to cover.

• We present more onsite coverage of trade shows and conference events than our competition, along with photos of major events, not found in other magazines.

I could go on, but I'd rather let you be the judge. Please review this issue from cover to cover, and send me your comments. Let me know what you'd like to see added (or removed), and where you think we need improvement.

[gselven@ChipScaleReview.com]