November - December 1999
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Products in the News
Phoenix X-Ray Launches Inspection Systems for PCBAsPhoenix X-Ray Systems has launched the first of a new range of x-ray inspection systems, beginning with the PCBA Inspector, a high-resolution microfocus unit dedicated to inspecting PC board assemblies.
The system is geared to detecting lead-based package solder voiding, lead-based package wetting, BGA/CSP/§ip-chip voiding and wetting.
The unit includes an integrated noise suppression system, and is designed for intuitive operation. Image processing with Windows NT and 5-axes manipulation are available as options.
Maximum sample size is 560 mm x 710 mm (22" x 28"), and X-Y scanning area is 460 mm x 610 mm (18" x 24"). The X-ray source is either 80 or 130 (closed) kV, with two spot focal diameters of 10/40 microns.
Phoenix X-Ray Systems, 3883 Via Pescador, Unit A, Camarillo, CA 93012, 805.389.0911 or info@phoenix-xray.com.
www.phoenix-xray.com
Aries Announces Universal Contact Block for Aseco S170D Handler
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| Aries Universal Contact Block |
The block consists of two separate sides, each with its own precision alignment features and mounting hardware. The design allows the S170D's plunging mechanism to travel below the surface of the PC board, thereby permitting full de§ection of Aries' patented Microstrip™ contacts.
The Microstrip contact is a contacting system that becomes part of the signal transmission line, providing extremely low self-inductance (.01 nH).
Aries Electronics Inc., P.O. Box 130, Frenchtown, NJ 08825, 908.996.6841, info@arieselec.com.
www.arieselec.com
Industrial Tools Debuts Products For Dressing Diamond Wheels
Industrial Tools Inc. has introduced the ULTRX™ product line of dressing sticks and dressing plates (bonded substrates).
The dressing plates, according to the company, provide process engineers with the ability to control the dressing of diamond wheels with the desired level of aggressiveness during the actual cutting procedure.
The plates help stabilize the cutting forces through a cut and cause less chipping while producing straighter cuts without the use of dressing sticks. The company says the plates do not expand when immersed in water.
The ULTRX products are offered in standard or custom sizes and are fabricated to high dimensional tolerances.
Industrial Tools Inc., 1111 S. Rose Ave., Oxnard, CA 93033, 805.483.1111 or iti@indtools.com.
www.indtools.com
Manufacturers' Services Introduces Time/Temperature Indicator to Detect Solder Freshness
Manufacturers' Services Ltd. has introduced the Time Temperature Indicator label for detecting solder paste freshness.
The development, according to MSL, will offer electronics manufacturers new control over process quality by ensuring the integrity of one of the most basic elements of the SMT manufacturing process.
Employing technology originally developed for the food industry by LifeLines Technology of Morris Plains, N.J., MSL customized the label to solder paste sensitivities and specifications. The label re§ects the environmental changes to a jar of solder paste with a simple, colored visual cue. Users compare the label color to a printed color reference guide to guage the paste's condition.
While solder paste is usually shipped with an expiriation date, MSL notes that unpredictable environmental factors, like an unrefrigerated delivery truck or power failure, can alter the paste's composition.
The TTI labels are available through LifeLines Technology at 973.984.6000.
Manufacturers' Services Ltd., 300 Baker Ave., Concord, MA 01742, 978.287.5630, fax 978.287.5635.
Vision Inspection Technology Announces New AOI System
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| The Vi-3000 automated optical inspection system |
The Vi-3000 employs a digital camera with 1300 x 1000 pixel resolution and a large field of view (48 x 37 mm). The Vi-3000 offers a proprietary vision card for digital conversion of images, which aids in the elimination of caused by noise.
In use, the Vi-3000 is installed at multiple locations in an SMT production line. These include placing units after the stencil printer (to check for solder paste deposits), after the chip shooter (to check for component placement), after the fine pitch placer (to inspect for proper component orientation) and after the reflow oven (to examine finished joint integrity).
The system uses Windows NT 4.0, and the Vi-3000 can be programmed in less than 15 minutes using Gerber, CAD or ASCII/Centroid supplied data. The system also incorporates SPC software tools and an extensive synthetic component library.
Vision Inspection Technology LLC, 179 Ward Hill Ave., Haverhill, MA 01835, 978.372.1230 or a href="mailto:vision@vitechnology.com" target=CHILD>vision@vitechnology.com.
www.vitechnology.com
BGA/CSP Micro Stencils Offer Fast, Accurate Alignment
OK International is offering Micro Stencils which replicate the original stencil printing process on a small scale during initial board assembly.
The stencils are designed to fit all current CSP solder attachment patterns, with custom stencils available. Since they are exactly the size of the CSP, they fit perfectly into the attachment area, offering fast, accurate alignment and the ability to make precise x and y adjustments with a true theta rotation.
OK International, 1530 O'Brien Drive, Menlo Park, CA 94025, 800.776.1778, fax 650.325.5932