Publisher's Letter eMail the Editor

Features Rambus Sockets Putting New Technology to Work in a Growing Market CSP Reliability for Single- and Double-Sided Assemblies A JPL-led consortia representing government agencies and private companies pooled in-kind resources to develop the quality and reliability of chip-scale packages (CSPs) for a variety of projects. In the process of building the test vehicles, many challenges were identified. Technical Forum New Approaches to Reliable Flexible Interconnections for CSPs We have developed two different approaches to achieve stress-free interconnections at low cost. One method employs molecularly flexible conductive adhesive as a solder replacement. The other approach (known as Chip-Coupler™ technology*), uses a molecularly flexible dielectric with embedded metallic wiring (of a substantial length) to decouple stress.