It's Independence Day for Chip Scale Review

This edition of Chip Scale Review represents the first issue published as an independent journal. After nearly three years, we are on our own, beholden to no single advertiser, company or individual. Hopefully, you will find that this issue also reflects positive changes, outstanding contributed articles and the greatest overall improvement since our first issue in May 1997, published as a Tessera-supported periodical.

From that 42-page issue to this, the singular goal has been to make each issue better and more useful to you, our readers. We have worked hard to become the single most requested (and respected) source of chip-scale electronics knowledge in the world.

Although we were formally sponsored by a supplier of chip-scale packaging technology, Chip Scale Review has always tried to offer a balanced view of the technology. As a result, in the first issue, you saw articles from Chip Scale Inc. and ShellCase Ltd., two of Tessera's competitors.

Now, as we continue our metamorphosis from a mostly company-supported publication to one that's supported completely by advertising, we will continue to welcome a diversity of viewpoints.

Chip Scale Review was started through the vision of Dr. Tom Di Stefano, Tessera founder. Tom believed that the infrastructure needed and deserved a publication that would help it grow internationally.

Judging by the many thousands of requests we've received for subscriptions since the magazine began, Tom was right. A publication addressing the most advanced forms of IC packaging with a sharp focus on chip-scale electronics, was badly needed until we came along.

Thanks are due to the small but loyal band responsible for helping publish each issue, including Joe Fjelstad, Ron Iscoff, Dr. Rao Mahidhara, Vern Solberg and Tom. Considering the legion of obstacles Chip Scale Review has faced in producing each issue, including the very limited, and mostly volunteer staff, the results speak for themselves.

As an independent journal, you can expect more from us—more topical articles, more experts speaking out and more special issues that you will want to archive because they represent the Rosetta Stone of advanced IC packaging.

With this issue, we are in transition from a manufacturing company-sponsored magazine to an advertiser-supported one. Over the next few issues, you will see several changes—for the better we hope. Some will be subtle and others will be quite obvious. Ron Iscoff, Chip Scale Review's founding Editor continues at the editorial helm and welcomes your suggestions for improvement.

Look for us to broaden our foreign coverage, with more news direct from Asia and Europe, more colorful graphics and improvements in our design. As we promised a few issues ago, we have begun to peer review our Technical Forum papers.

Even though it means more work for us, we're doing it to improve the quality of the material we present to you in each issue. Rather quickly, you will also see noticeable improvements in our circulation fulfillment and in the timeliness with which you receive your magazine.

We're going to expect more from you, as well. We need your best original articles. We need your letters. And most of all, we need your feedback and support.

Please continue to let us know what you like. We're always ready to listen as we continue our journey into this most exciting technology together. Please don't hesitate to contact me with your questions, comments or suggestions at gselven@aol.com.

Yours truly,
Gene Selven
Publisher