Industry News - 2018

May 2018


Alpha Assembly Solutions Acquires HiTech Korea CO., LTD

Somerset, NJ – May 9th, 2018 – Alpha Assembly Solutions, a world leader in the production of electronic soldering and bonding materials, has recently announced their acquisition of HiTech Korea Co., LTD (HiTech), a premier electronics assembly polymer and epoxy-based materials supplier, with its primary operational facility in Korea.

“We are excited to announce that HiTech is joining the Alpha family,” said Rick Ertmann, President of Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses. “We believe that HiTech’s talent and resources will augment our expertise to develop new and improved products and capabilities. With this transaction, Alpha is well-situated to capitalize on many emerging trends in the electronics industry. As the lines between the assembly technologies in electronics continues to merge, we see this acquisition as one of many steps that we are taking to position the business for continued success as we work with customers to solve their assembly challenges.”

This acquisition is aligned with Alpha and MacDermid Performance Solutions strategic goals and priorities, namely to drive growth through the delivery of innovative, value added solutions and services into the electronics assembly industry. HiTech’s leading products and development initiatives focus on high growth segments, such as underfills, encapsulants, low-temperature adhesives and ultraviolet adhesives.

For more information on HiTech or Alpha’s unique product and process solutions, visit AlphaAssembly.com or Contact: Jimmy Shu, Jimmy.Shu@alphaassembly.com


Cohu to acquire Xcerra

Poway, CA., & Norwood, MA - May 8, 2018 - Cohu, Inc. (NASDAQ:COHU) and Xcerra Corporation (NASDAQ:XCRA) announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock. The acquisition is expected to make Cohu a global leader in semiconductor test, with combined sales for Cohu and Xcerra in excess of $800 million for the last twelve months.

Upon the closing of the transaction, Xcerra shareholders will be entitled to receive $9.00 in cash and 0.2109 of a share of Cohu common stock, subject to the terms of the definitive agreement. Based on the closing price of Cohu common stock as of May 7, 2018, the transaction values Xcerra at $13.92 per share, or approximately $796 million in equity value, with a total enterprise value of approximately $627 million, after excluding Xcerra’s cash and marketable securities net of the debt on its balance sheet as of January 31, 2018. The transaction value represents a premium of 8.4% to Xcerra's closing price on May 7, 2018, and a premium of 15.4% to Xcerra's 30-day average closing price.

"This proposed acquisition is a powerful combination of two complementary companies that will accelerate our strategy to diversify our product offerings and strengthen Cohu’s position as a global leader in back-end semiconductor equipment. The depth and breadth of the combined product portfolios, engineering and product development resources, as well as the global customer support platforms will enable us to deliver comprehensive semiconductor back-end solutions that better meet the future needs of our customers,” commented Luis Müller, Cohu's President and CEO. “The acquisition of Xcerra increases our addressable market to approximately $5 billion across handlers, contactors, test and inspection, further strengthening our ability to fully capitalize on the secular growth opportunities in the automotive, IoT, industrial and mobility markets. We are excited to welcome the Xcerra team to Cohu and look forward to an efficient completion of the transaction, with a focus on delivering long-term value to our customers, employees and shareholders."

The transaction is expected to be immediately accretive to non-GAAP earnings per share and generate over $20 million of annual run-rate cost synergies within 2 years of closing, excluding stock-based compensation and other charges. Cohu intends to fund the cash payable to Xcerra shareholders with a combination of cash on hand from the combined companies’ balance sheets, and approximately $350 million in debt financing. The transaction is expected to close in the second half of calendar year 2018, subject to approval by both companies’ respective shareholders, antitrust regulatory approvals and other customary closing conditions. Xcerra shareholders are expected to own approximately 30% of the combined company upon the closing of the transaction. The transaction has been unanimously approved by the Boards of Directors of both companies. Luis Müller will remain president and chief executive officer and lead the combined company, and Jeff Jones will continue to serve as vice president of finance and chief financial officer. Two members of Xcerra's board of directors will join Cohu's board upon the closing of the transaction.


EV Group begins construction of new manufacturing III building to expand production capacity

St. Florian, Austria, May 2, 2018 - EV Group (EVG) announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG's "Manufacturing III" facility, which will more than double the floor space for the final assembly of EVG's systems.

"With our innovative manufacturing solutions for the high-tech industry as well as new biomedical applications, we operate in very dynamic markets with great future prospects," stated Dr. Werner Thallner, Executive Operations and Financial Director at EV Group. "In light of the high-capacity utilization in all areas of our existing facilities, as well as the positive market outlook, we decided to implement our plans for building our Manufacturing III facility this year. This will support our long-term growth targets at our corporate headquarters in St. Florian am Inn."

From left to right: Paul Lindner, Hermann Waltl, Erich Thallner,Aya Maria Thallner, Dr. Werner Thallner / EV Group Executive Board
The new Manufacturing III building, adjacent to the new test room site that was opened just a few months ago, will be built next to the river Inn. The building will provide about 4,800 square meters of additional space in total, which will benefit not only manufacturing, but other departments as well. In addition to an expansion of warehouse space, a new delivery area with a dedicated packaging site designed for cleanroom equipment will be created, along with an airfreight security zone and new truck loading docks for the shipment of the completed systems to EVG's worldwide customers. The construction of the new Manufacturing III building is set to be completed in early 2019.


ASE Industrial Holding, Co., Ltd. completes equity exchange on the Taiwan (TWSE) and New York (NYSE) Stock Exchanges

April 30, 2018 Kaohsiung City, Taiwan - ASE Industrial Holding Co., Ltd. is jointly established by the combination of Advanced Semiconductor Engineering, Inc. and Siliconware Precision Industries Co., Ltd (SPIL). ASE Industrial Holding will enhance research and development capability, expand global market footprint, contribute advanced technical support for next-generation applications, and provide miniaturized, high-quality, highly integrated, and fast time-to-market services to all customers.

ASE Industrial Holding is the leading provider of semiconductor manufacturing services in assembly and test. The company develops and offers complete turnkey solutions covering front-end engineering test, wafer probing and final test, as well as IC packaging, materials and electronic manufacturing services through USI. By integrating the resources of each business entity, the new holding company remains committed to long term partnerships for a sustainable future.

ASE Industrial Holding’s global manufacturing facilities are strategically located in Taiwan, China, South Korea, Japan, Singapore, and Malaysia, Mexico as well as the Americas and Europe, with 90,000 employees.

Milestones

  • In June, 2016, ASE and SPIL entered into the Joint Share Exchange Agreement, pursuant to which, the board of directors from ASE and SPIL approved the formation of ASE Industrial Holding Co., Ltd.
  • On February 12, 2018, ASE and SPIL respectively held Extraordinary General Meetings and each approved the proposed Joint Share Exchange plan, pursuant to which, the to-be-established ASE Industrial Holding will acquire 100% of shares of both ASE and SPIL.
  • On April 30, 2018, ASE Industrial Holding listed on the Taiwan Stock Exchange (TWSE code: 3711) and New York Stock Exchange (NYSE code: ASX) through the issue of ADR.

Members of ASE Industrial Holding Co., Ltd.

Advanced Semiconductor Engineering Inc. & Siliconware Precision Industries Co.Ltd., the leading companies of semiconductor assembly and test services. USI Inc., a leading electronic manufacturing service provider.


ASM Pacific Technology Ltd. completes acquisition of AMICRA Microtechnologies GmbH

Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific Technology Ltd. (“ASMPT”) announced that it has completed its acquisition of 100% of the shares of AMICRA Microtechnologies GmbH (“Amicra”). Amicra is a leading supplier of high-precision die bonders for the photonics and advanced packaging markets. The transaction, which completed on April 4, 2018 will bring about a strengthened business, well-placed to serve not only the fast growing silicon photonics assembly equipment market, but also the wider high-precision flip-chip and die bonding markets.

Headquartered in Singapore and listed in the Hong Kong Stock Exchange, ASMPT is the world’s largest back-end semiconductor equipment supplier and SMT solutions provider. ASMPT will rename Amicra to ASM AMICRA Microtechnologies GmbH as it integrates Amicra into ASMPT’s back-end equipment segment.

“We are excited about this strategic investment,” said Mr. Lee Wai Kwong, CEO of ASM Pacific Technology. “Amicra’s sub-micron high-accuracy die bonder is complementary to the Group’s existing product portfolio. Amicra has a leading position in the photonics market, which the Group believes is of high-growth potential. I am confident that this combination will further strengthen our future growth opportunities and help to deliver even higher value-add to our customers.”

“Following our increasing penetration of markets for high precision die attach, especially in the rapidly growing area of silicon photonics manufacturing, it makes a lot of sense to merge with a strong strategic partner to better support our growing international customers base,” noted Rudolf Kaiser, Managing Director of Amicra. “With their scale and established international supply chain, sales channel and customer support capability, the merger with ASMPT will allow us to take next steps in the further development of our business. I am happy for Amicra and our customers and I am excited about the opportunity to work with ASMPT.”


ASM Pacific Technology Ltd. signs agreement to acquire TEL NEXX, Inc.

Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific Technology Ltd. (ASMPT) announced that it has signed a definitive agreement with Tokyo Electron Limited (TEL) to acquire TEL NEXX, Inc. (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing its growth strategy of tapping into new high-growth markets and expanding their product offerings to the semiconductor advanced packaging market.

Established in 2001, NEXX is an industry leader in the advanced packaging market and has strong technological capabilities in the highly specialized electrochemical deposition (ECD) and physical vapor deposition (PVD) technologies. This new business acquisition will be subsumed under the back-end equipment segment of ASMPT.

“This strategic acquisition complements our current offerings in advanced packaging applications and establishes ASMPT as a premier interconnect technology company, while supporting our commitment in driving innovation and delivering the highest value and innovative solutions to our customers,” said Lee Wai Kwong, CEO of ASMPT. “By combining NEXX’s highly specialized ECD and PVD technologies, we see tremendous opportunity to grow our business in the advanced packaging market, which is being driven by the dawn of the data-centric era.”

"ASMPT offers an exciting opportunity for NEXX to boost and expand its product offerings in advanced wafer-level packaging, ECD and PVD,” said Toshiki Kawai, President and CEO of TEL. “TEL believes that NEXX will benefit from greater synergies with ASMPT’s outsourced assembly and test customers.”

"With the demand for semiconductor devices at a historical high, we are looking forward to an increased global customer footprint with ASMPT, as well as expanded sales and service capabilities for our customers,” noted Tom Walsh, President of NEXX.

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