March Industry News

STATS ChipPAC Introduces Scalable 3D eWLB Solutions

Semiconductor test and advanced packaging service provider, STATS ChipPAC Ltd. announced its next-generation 3D embedded Wafer Level Ball Grid Array (eWLB) Package-on-Package (PoP) solutions. This innovative 3D technology reportedly provides an ultra thin package profile height below 1.0mm, a 30% height reduction over the industry standard 1.4mm total stacked package height.

While current PoP technologies are effective in integrating multiple functions in a small form factor, reaching the next level of packaging bandwidth and performance in more advanced mobile devices drive advancements in the stacked package profile height below 1.0mm as well as tighter substrate line/space capability. By utilizing eWLB's fan-out wafer level packaging approach, STATS ChipPAC has been able to reduce the bottom PoP package height to less than 0.5mm. eWLB PoP is available in either a single or double-sided configuration and provides a flexible integration platform for stacking a wide range of memory packages on top with a final stacked package height below 1.0mm.

"With eWLB we are able to offer a next-generation 3D PoP technology that achieves heterogeneous die integration and higher input/output (IO) density in a significantly smaller footprint than is possible today with standard PoP and flip chip technology. The maximum benefits of eWLB PoP can be achieved through a co-design process with our customers to optimize the functional performance of this ultra thin 3D package," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. "This is the thinnest 3D PoP solution available in the industry today and it delivers significant cost and performance advantages for our customers."

Multitest's DuraPad™ Shown to Reduces Pad Wear

Multitest, designer and manufacturer of final test handlers, contactors and load boards, announces that its proprietary DuraPad™ surface has been proven to significantly reduce the effects of pad wear caused by pogo pin style contactors. Specifically, fine-pitch boards of 0.5 mm or below and boards for resistance sensitive testing are particularly vulnerable to pad wear. DuraPad™ brings substantial cost of test savings to high-volume production sites of array packages and WLSCPs.

Multitest has performed extensive pad wear analyses to understand the actual issues with established surface coatings and to be able to provide the DuraPad™ solution. The company's unique product portfolio of handlers, contactors and boards, enabled the engineers to apply Multitest's comprehensive knowledge of the mechanical interactions. The results were presented at BiTS 2010 and 2011. The papers are available for download at www.multitest.com/padwear.

100 Million eWLB Components Shipped

Nanium, one of several suppliers worldwide of the fan-out wafer level package known as embedded wafer level ball grid array (eWLB), recently announced it has shipped more than 100M units of the component. Located in Vila do Conde (Porto), Portugal, the company ramped to volume production on 300mm reconstituted wafers at the end of 2010 and reports the operation is running at full speed with assembly yields typical of a mature volume assembly technology.

Mainly used in wireless communication applications, eWLB technology is on the way to enter various other applications like MEMS for the consumer market,stacked die DRAM multichip packages (MCP) for high capacity memory applications, mixed signal RF ASIC with high power dissipation, heterogeneous integration within System-in-Package (SiP) and others. NANIUM reports that its development team is working on the implementation of a comprehensive technology roadmap for FO-WLP. Besides preparing new wireless communication products for a number of different customers, its main target is to widen the application fields of the technology and introduce eWLB into new markets. Several new products are already in development and will enter production from the second half of the year onwards.

Endicott Interconnect Technologies, Inc. Appoints Eltek as Sales Partner in Israel

Endicott Interconnect Technologies, Inc. has extended its sales network with the appointment of Eltek as its sales partner for Israel, in order to strengthen its infrastructure and presence in the region. Under terms of the agreement, Eltek will generate opportunities to market Endicott Interconnect's microelectronic packaging solutions.

According to Steve Payne, Director of European Sales & Marketing for EI, the company chose to work with Eltek because its position as a PCB company within Isreal provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect's microtechnology product range, with a special emphasis on system-in-package (SiP) solutions. "I am confident that our new customers in the region will benefit from our differentiating solutions," he said.

Roberto Tulman, Eltek's CTO, said the benefit of the partnership for Ektek is that the company will now be able to penetrate the market more deeply and expose its customers to cutting edge solutions. "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability," noted Tulman.

Integra Technologies Expands IC Test Facility for Growth

Integra Technologies LLC., supplier of integrated circuit test and evaluation services in the U.S. and Europe, announced it has completed the expansion of its primary test facility in Wichita, KS, adding over 5000sq ft. to bring the total floor-space to just over 41,000sq ft.

The addition reportedly expands the main test floor and adds office space for new engineers. According to the company, the expansion was driven by both customers' needs as well as the increasing complexity of IC devices being produced and utilized in the electronics industry today. More complex devices require larger and more capable test equipment to test them as well as additional test engineering resources to fully utilize the additional equipment capability.

"We appreciate the continued confidence our customers have in us, despite the challenging general economic environment we are all enduring," said Joe Holt, VP of Business Development at Integra. "The employee-owners of Integra work hard to satisfy our customers and this expansion is one validation of these efforts."

SUSS MicroTec launches Platform for Permanent Wafer Bonding, Debonding and Cleaning

SUSS MicroTec, supplier of semiconductor equipment and process solutions, announced the launch of the XBC300 Gen2 (Figure 2), a high-volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development.

Configurable with a wide selection of process modules, the new universal bonder platform is suitable for all major permanent bonding including Cu-Cu, polymer, fusion and hybrid bonding. Additionally, when configured as a debonder and cleaner the XBC300 Gen2 is the complementary platform to SUSS MicroTec's XBS300 temporary wafer bonder. Device wafers are temporarily bonded to a carrier in the XBS300 and are debonded on the XBC300 Gen2 after passing all the backside processing steps. The XBC300 Gen2 debonder / cleaner is configured for handling both, carrier wafers as well as film frames. It allows for room temperature mechanical debonding and subsequent cleaning of carriers and device wafers.

According to Frank P. Averdung, President and CEO of SÜSS MicroTec AG, this second generation tool allows complete process flexibility with full automation, which translates to a lower cost of ownership. "While the first generation XBC300 only offered configurations with up to three process modules, the new generation can be equipped with up to six modules, enabling the high throughput required in volume manufacturing." He noted, adding that the state-of-the-art tools provide customers with what they need for thin wafer handling in 3D integration and 3D packaging processes.