Thermal Management Topics at ECTC 2011

If thermal management is your area of interest, you can find several interesting ways to spend your time at the 2011 Electronic Component Technology Conference (ECTC), which takes place from May 31-June 3, at the Swan and Dolphin Resort in Disney World. This year's program includes one thermally focused professional development course and two sessions devoted to thermomechanical modeling and themomechanical reliability, respectively.

On Tuesday, May 31, from 1:15pm-5:15pm, Avram Bar-Cohen, University of Maryland, and Karl Geisler, General Dynamics Advanced Information Systems will co-lead a course titled On-Chip Thermal Management of Nano-Electronic Components. This course focuses on the application of advanced chip-level high heat flux cooling techniques that are required for the thermal management of 3D nanoelectronic packages. Its well known while 3D chip stacking increases package device density and reduces chip-to-chip interconnect delays, these advantages come at the expense of higher heat densities and decreased physical access to the chip surfaces for heat removal. Successful development of this cooling strategy requires the integration of thermal management principles and concepts into the design and development process from the earliest stages of product design. Following a brief review of the iNEMI/ITRS thermal roadmaps and conventional thermal packaging technology, attention will turn to thermal interface materials, high-performance heat spreaders, solid state thermoelectric coolers (both miniaturized and thin-film TECs), and direct liquid cooling.

On Wednesday, June 1, from 1:30 PM - 5:10 PM Session 10 of technology program focuses on Thermomechanical Reliability. Co-chairs S.B. Park, of Binghamton University, and Tim Chaudry, of Broadcom, have put together a program that covers thermomechanical reliability issues from the chip to the board. Presentations include:

• Squeezing the Chip: The Buildup of Compressive Stress in a Microprocessor Chip by Packaging and Heat Sink Clamping
• Cooling Rate, Pad Finish Effects on Mechanical Behavior of SnAgCu Alloys
• Characterization of Fine-Pitch Solder Bump Joint and Package Warpage for Low K High-Pin Count Flip-Chip BGA through Shadow Moiré and Micro Moiré Technique
• Underfill & Package Acceleration Factor Based on Thermal Fatigue Fracture
• Mechanical Characterization of Next Generation eWLB (Embedded Wafer Level BGA) Packaging
• Effects of Shock Impact Repetition Frequency on the Reliability of Component Boards
• Comparison of LED Package Reliability under Thermal Cycling and Thermal Shock Conditions by Experimental Testing and Finite Element Simulation
• Reliability Specification Based on PCB Bending Analysis
• The Study on the Thermal Cycle and Drop Test Reliability of System-in-Packages with an Embedded Die

On Thursday morning from 8:40-11:00am, Session 17 of the general technology program will be devoted to Thermomechanical Modeling as part of the Simulation and Modeling track. Co-chairs Andrew A.O. Tay, National University of Singapore, and L.J. Ernst, Delft University of Technology have put together a line-up of presenters from industry and academia who will address thermomechanical processes for leading-edge packaging including system-in-package, wafer level packaging, and 3D Integration. Paper titles include:

• Modeling Characterization and Reliability Analysis of a Power System in Package
• A New Thermomechanical Fracture Analysis Approach for 3D Integration Technology
• A Fast Simulation Framework for Full-Chip Thermo-Mechanical Stress and Reliability Analysis of Through-Silicon-Via Based 3D ICs
• Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures
• Exploration of the Design Space of Wafer Level Packaging through Numerical Simulation
• Issues in Fatigue Life Prediction Model for Underfilled Flip Chip Bump
• Interrogation of Accrued Damage and Remaining Life in Field-Deployed Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling

For a full line up of this year's ECTC program and to register for the event, visit www.ectc.net