May Industry News

Nordson ASYMTEK Launches Jetting Breakthrough

Fluid dispensing, coating, and jetting technologies experts, Nordson ASYMTEK, introduced the new, patent pending, NexJet™ System, reported to be a significant advancement representing the next step in jetting technology. Central to the system is the Genius™ Jet Cartridge, an innovative, one-piece jet that is quickly and easily removed without tools. The jet cartridge has built-in memory to store usage data like the number of cycles and cartridge type. The NexJet System includes precision software control of the jetting process, enabling successful results with both low- and high-viscosity fluids, and accommodates a broad range of fluids for applications such as flip chip underfill, chip scale package, ball grid array, package-on-package underfill, precise coating, and adhesive dispensing at reportedly a lower cost of ownership than its competitors.

"Jetting is one of the most popular ways to dispense fluids during production. Nordson ASYMTEK pioneered jetting with the development of the first DispenseJet® series of valves in 1994, and today our jets are installed globally in the widest range of dispensing applications," said Peter Bierhuis, president, Nordson ASYMTEK. He added that the NexJet jet revolutionizes the construction of the jet itself, setting new standards for ease of use, smart operation, extended capability, and flexibility.

Integra Technologies Expands Counterfeit Detection Services

As part of its recent test facility expansion in January, Integra, supplier of integrated circuit test and evaluation services in the U.S. and Europe, announced the expansion of their current Counterfeit Detection Services in Wichita, Kansas.

The company said it has acquired new equipment that will increase capacity and decrease lead times. Integra has been at the forefront of the effort to eliminate counterfeit components for many years and is proud to have leading counterfeit experts on its staff. The company offers one of the industry's broadest portfolios of counterfeit detection services with the capability to identify sophisticated counterfeit products across all IC device technologies.

"Counterfeit detection is an important area of concern for our Military, Aerospace and Defense customers," said Mark Marshall, VP of Engineering at Integra. "Today's counterfeit components are becoming harder and harder to detect as the counterfeiters continue to improve their techniques. At Integra we are committed to staying ahead of them and doing everything we can to help our customers combat this industry problem."

Thermal Management Solution for IC devices

Ironwood Electronics' has introduced a high performance thermal socket lid -TSL-ST-01 that is said to allow any IC devices to be placed inside any socket and operated at IC's extreme temperature to determine its thermal capability. Thermal Socket Lid & Control Systems enable temperature control of IC devices during thermal characterization using direct thermal contact technology that provides accurate and stable temperatures on IC resulting in precise characterization.

The three main components of the thermal management system are the thermal socket lid, the chiller and the controller. The chiller supplies chilled liquid to the thermal socket lid. The controller has a constant feed back to monitor the thermal socket lid and supply the necessary electrical input to accurately control the temperature. The thermal socket lid has two main functions. One is to transfer heat to the IC device and the other is to compress the IC device on the interconnect unit. Thermal socket lid along with control system precisely controls the temperature of the IC while it is being tested. Thermal socket lid replaces actual socket lid on top of a test socket. The thermal socket lid has replaceable compression plate to accommodate various IC sizes. An additional accessory called "socket frame" is needed to interface thermal socket lid to the socket body. In addition to hardware, software that enables more features than just representing the front panel of the controller by itself is provided. It also has an easy to use graphical user interface (GUI). Features include the ability to set a temperature, tune the system, change and save configurations setting, log data and run custom scripts.

Royce Instruments Introduces Improved Bond Testing

Based on the company's field-proven technology, Royce Instruments launched its 600 Series of bond test instruments. This series is said to be the result of an intensive development effort dedicated to advancing bond test instrumentation, and offers a comprehensive family of bond testing solutions - from the high-end Royce 650 to the reliable and affordable Royce 610. The Series includes a universal bond tester, multitest bond tester, dedicated wire pull bond tester, and a centralized database. According to the company, the series offers such key advantages as:

• Unparalleled data management capabilities with instruments linked to a centralized database, allowing test information to be shared over a network and centrally managed.
• Interchangeable tooling, for greater flexibility and cost savings
• Scalability, which means the Royce 600 Series will continue to meet your needs as they evolve.

Micro Control Company Releases HPB-5C Burn-In with Test System

Micro Control Company introduced its HPB-5C High-Power Burn-In System, featuring variable airflow control as part of the active thermal control of each device under test. Variable airflow control makes it possible for the operator to adjust the speed of the oven blower during system operation on a device by device basis as it is required. The HPB-5C also has an increased vector memory depth has over previous Micro Control burn-in systems. A 32M vector memory is now standard with 64M optional. Increased vector memory makes running large numbers of test vectors possible without waiting for time consuming reloads.

The HPB-5C provides individual temperature control to each device under test, ensuring that the proper thermal stress is applied to individual devices during the burn-in cycle. The active thermal control feature in the HPB-5C provides precise temperature control for each device under test while supporting a wide range of test strategies. For applications that do not require individual temperature control of the devices, many more devices can be burned in with test during a burn-in cycle.