October Industry News

STATS ChipPAC's Next-Gen FOWLP Platform Targets Broader Application Range

STATS ChipPAC has announced that its next-generation fan-out wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including smartphones, media tablets and cloud computing applications.

Rapid technology convergence driven by the growth of mobile and internet-enabled devices and emergence of small application programs is fostering a new generation of multi-functional highly innovative end user devices that can handle data, voice, video and media for convenience, mobile entertainment and a richer overall user experience at unprecedented levels. The telecommunications, information technology, consumer electronics and media sectors are looking for ways to differentiate products and solutions by integrating more advanced features, processing capabilities and enhanced user interfaces into electronic devices and their applications. The anticipated growth of the converging markets has intensified the drive for innovative product solutions and increasingly requires a new class of semiconductor packages with the attributes necessary to meet this broad set of performance needs.

One of the key technologies in STATS ChipPAC's FO-WLP technology platform is embedded Wafer Level Ball Grid Array (eWLB). With its high-performance and power-efficient capabilities in an inherently small, ultra-thin package profile, eWLB has gathered momentum as a technology enabler for semiconductor companies in the smartphone market. STATS ChipPAC has shipped over 150 million eWLB units at an increasing rate into this market segment which has seen continuous strong growth.

Amkor to Acquire Malaysian Semiconductor Assembly and Test Operations

Toshiba Corp. and Amkor Technology, Inc. have signed a non-binding memorandum of understanding for the acquisition by Amkor of Toshiba Electronics Malaysia Sdn. Bhd. ("TEM"), Toshiba's semiconductor assembly operation in Malaysia, together with a license to Amkor for certain related intellectual property rights. Subject to the satisfactory conclusion of due diligence, negotiation and signing of definitive agreements and receipt of any necessary government approvals, Toshiba and Amkor expect to complete the transaction by early January 2012.

Established in 1973, TEM has steadily expanded the scale of its assembly operations, primarily of discrete and analog semiconductors. In recent years, its main product has been power semiconductors.

Toshiba positions power semiconductors as a driver of growth for its semiconductor business and seeks to maximize cost competitiveness across its front- and back-end operations. Transferring ownership of TEM to the Amkor group will allow TEM to take full advantage of Amkor's large scale production and material procurement capabilities and boost the overall efficiency of its power semiconductor operations.

Toshiba will continue to subcontract power semiconductor assembly and test to TEM as an important source of key products. As it does so, Toshiba will shift its focus and resources to front-end wafer fabrication for power semiconductors by reinforcing production capabilities at Kaga Toshiba Electronics Corporation, Toshiba Group's discrete semiconductor production base in Japan's Ishikawa Prefecture.

Amkor expects the transaction to further strengthen its relationship with Toshiba and to grow its semiconductor assembly and testing business. In particular, Amkor believes that TEM will provide an excellent platform for increasing its presence in the power discrete market, where Amkor estimates there is unmet customer demand for outsourced assembly and test services.

Multitest's MT2168 Optimizes for Cost and Throughput for Less than 16 Sites

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that the MT2168 fully leverages today's tester capabilities in terms of shorter test times and higher parallelism e.g. 16 sites. However, there are plenty of applications in the market where the number of simultaneously tested devices is lower than 16. The MT2168 is suited to these applications as well because of its innovative and fast internal material handling system; high soak capacity and its highly scalable design.

Regardless of the number of parallel tested devices, the test times get shorter. For these applications, the test handlers need to fulfill their standard tasks of loading, soaking and sorting in a reduced time span. Often, the speed of traditional handlers cannot keep up the pace. The tester stays idle and is ready and waiting for the devices. Additionally, the limited soak capacity often makes traditional handlers a bottle neck for the test cell. Again, the tester needs to waiting for the handler. The overall test cell output is not at its optimum capacity. The outstanding soak capacity and the innovative material flow of the MT2168 perfectly respond to the reduced test times. This also is true for applications with less than 16 sites.

For longer test times, where sorting speed and soak capacity is not a factor, the MT2168 can be scaled down. Configurating the MT2168 according to the actual (speed) need reduces the initial investment cost. The customer only needs to purchase what is actually needed. On the other hand, the MT2168 can be upgraded easily in the field later if the requirements change.