The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

Current Issue: January - February 2012

• Wafer Cleaning
• Copper Wire Bond
• LED Packaging Trends
• Temporary Bonding/Debonding
• International Directory of Test & Burn-in Socket Suppliers

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White Papers Bondtesting of Overhanging Die Detecting Counterfeit Components High-Speed Bondtesting: Understanding the Technology Process Control of Wet Etching for Silicon Wafer Thinning

CSR Stock Index
Symbol	Name	Last	Pct Change
ASX	Advanced Semicond	4.72	1.51
AEHR	Aehr Test Systems	0.77	0.00
AMKR	Amkor Technology	6.07	1.34
AMAT	Applied Materials	12.79	1.19
ASMI	ASM International	35.05	3.27
CSCD	Cascade Microtech	3.63	0.00
IMOSD	IMOSD	0.00	0.00
INTC	Intel Corporation	26.74	1.75
KLAC	KLA-Tencor Corpor	51.98	0.87
KLIC	Kulicke and Soffa	11.63	2.11
LRCX	Lam Research Corp	44.19	-0.72
NEWP	Newport Corporati	19.49	2.31
NDSN	Nordson Corporati	47.90	3.03
QCOM	QUALCOMM Incorpor	61.06	0.54
RTEC	Rudolph Technolog	10.83	1.21
ST	Sensata Technolog	31.00	1.74
SPIL	Siliconware Preci	5.47	-0.91
STM	STMicroelectronic	7.01	0.29
TGAL	Tegal Corporation	3.12	0.00
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